Wednesday, July 07, 2004

New Positions

Here are a few positions:

RF Board Design Engineer: 8+ years experience with BSEE or MSEE. Experience on small-size board and Microwave Office, Eagleware, ADS, Orcad schematic capture and other related tools are preferred. The company is looking for someone has gone through initial design up to production. Location: Bay area, CA

Application Manager: 7+ years experience with MSEE or BSEE. The company is looking for someone has extensive experience on 10G/G PHY and Transceiver for optical communications. The job requires experience on technical application and testing, interface with customer as well.Location: Bay area, CA

RFIC Design Engineer: 5+ years experience in RFIC in BiCMOS or SiGe. Experience required on the following key blocks: LNA, Mixer, Filter, etc. Location: Irvine, CA

High-Speed Data Converter Designer. CMOS ADCs such as Pipeline, Folding, Flash, Interpolating. Exciting new project with small team in public company. Northeast

Senior Systems Engineer, to write application and boot code in C, perform bringup, implement algorithms. Experience in wireline communications is ideal. Southern Calif.

Principal Analog IC Design Engineer - High-Speed. Southern Calif.

Director of Analog Design - High-Speed. Southern Calif.

Senior Serial IO/Signal Integrity Engineer - Should have 5+ years experience, with good knowledge of high-speed pll design and noise/jitter issues. Texas

Principal Staff Engineer - Looking for a strong background in high-frequency (GHz+) communications design - systems and circuits. Specific exposure to Bandpass DSM very desirable. MSEE + 10 years. Texas

Senior Test Engineer - BS/MS + 5 years. Must have worked with Teradyne J750. Experience with Flash/EEPROM desirable. Arizona

Senior Product Engineer - BS/MSEE + 5 years. Must have experience with standard analog products. Silicon Valley

Principal Design Engineer – Orange County
MSEE or Ph D degree in Electrical Engineering from an accredited university
10+ years of industrial experience in the design of mixed-signal integrated circuits minimum of 3 years of IC design specifically for optical communications design experience at GHz frequencies, with a strong preference for 10 GHz and above

Principal Engineer & Sr. Design Engineer– Pacific NW
Eight or more years experience in high-speed analog and digital circuit design. Five or more for the Sr. Design role.
The successful candidate will lead a team designing very high speed mixed-signal CMOS integrated circuits for high bit rate systems. The job entails helping to define the product, system level behavioral simulations, extensive transistor level design and simulation, evaluation…

Senior Analog / Mixed-Signal IC Design Engineer - Austin
Experienced CMOS analog circuit designer. Must have core analog sub-circuit and block level design experience. Some exposure to basic logic design is necessary An MSEE is preferred, plus 5 years minimum in analog CMOS design for mixed-signal IC’s.


If you are interested in finding out more about these positions, please email me

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Norman Paratore who is a recruiter for National Semiconductor in Annapolis Junction, Maryland let me know about the following three positions he is looking to fill. he let me know that Due to the sensitive nature of the work they do in that location, all of the candidates must be US Citizens. Additionally, their entire immediate family (mother, father, sisters, brothers, spouse, and children) must also be US Citizens. Obviously, anyone with an active TS/SCI clearance would be given higher consideration.


Packaging Engineer/Supervisor 3rd Shift - Job # 5582879 Provides sustaining engineering support to MCM and ceramic packaging lines. Conducts tests and research on basic materials used in production. Coordinates the introduction of new package types, equipment, and processes into production. Builds prototype assemblies and enhances throughput by providing continuous improvement of existing processes. Supervises the activities of 3rd shift operators and technicians. Minimum requirements: 5 years microelectronics packaging experience with a B.S. degree.

Manufacturing/Equipment Technician - multiple job #s - 2nd shifts - Sets up, programs, qualifies, and sometimes operates various pieces of assembly equipment such as the wafer saw, die bonder, and wire bonder for prototype and production assembly of IC's. Maintains and repairs all types of assembly equipment. provides daily production support and performs other related job duties as required. Minimum requirements are: AA/AS/Certificate in Microelectronics or International equivalent with 2 to 4 years of direct experience.


Assembly and Fabrication Operators - multiple job #s - Will work in the manufacturing or assembly areas of chip development. Must be able to stand for long periods of time and work in a clean room environment. Only 2nd and 3rd shifts available. Prefer someone with semiconductor experience but will accept other assembly type experience. Must have a High School diploma or GED.

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I wanted to make mention again of a great startup company called Open Silicon. They have a number of positions open and you can view them here.

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